UNIVERSITY OF WATERLOO PROFILE
In just half a century, the University of Waterloo, located at the heart of Canada’s technology hub, has become a leading comprehensive university with more than 36,000 full- and part-time students in undergraduate and graduate programs.
Consistently ranked Canada’s most innovative university, Waterloo is home to advanced research and teaching in science and engineering, mathematics and computer science, health, environment, arts and social sciences. From quantum computing and nanotechnology to clinical psychology and health sciences research, Waterloo brings ideas and brilliant minds together, inspiring innovations with real impact today and in the future.
As home to the world's largest post-secondary co-operative education program, Waterloo embraces its connections to the world and encourages enterprising partnerships in learning, research, and commercialization. With campuses and education centres on four continents, and academic partnerships spanning the globe, Waterloo is shaping the future of the planet.
Find out more about the University of Waterloo at https://uwaterloo.ca/about/who-we-are/waterloo-facts.
Background
The Wafer Bonding System, which is the subject of this RFP, is to be utilized as part of the nanofabrication toolset in the Quantum-Nano Fabrication and Characterization Facility (QNFCF) located in the Quantum-Nano Centre at the University of Waterloo. The Quantum-Nano Centre is one of the top research centres in Canada that enables scientists and engineers to pursue frontier research in materials science, nanotechnology, and quantum information processing.
The QNFCF incorporates ISO 4, 5 and 6 rated cleanrooms geared towards servicing a wide range of nanofabrication experiments for graduate and post-graduate researchers with varying degrees of expertise and experience. As such, all instruments in this facility, including the Wafer Bonding System, must be well proven with numerous installed units successfully operating in the field, and be user friendly, versatile and robust. The Wafer Bonding System must also have a low cost of ownership with excellent uptime and reliability.
The budget for the project is capped at $340,000 CAD, plus HST.
This Request for Proposal is issued in concert with funding in part from the Canadian Foundation for Innovation (CFI), and should follow all CFI Guidelines and Policies – please refer to pages 3 and 4 of the RFP document for details.
Questions regarding this Request for Proposal may be submitted in writing (via email) to the RFP Contact Person as follows:
Christine Wagner, CPPB, CSCP, Senior Buyer - Procurement and Contract Services
200 University Avenue West
University of Waterloo, East Campus 2
Waterloo ON N2L 5Z5
Email: cpwagner@uwaterloo.ca or, procure@uwaterloo.ca
